06/01/2026 15:00
Motive Powers Latin America’s Next Wave of Mobile Innovation

Motive, a global leader in entitlement and connected device & service management, joined operators and industry leaders at M360 LATAM in Mexico City, showcasing live deployments across the region's most consequential use cases: Satellite Direct-to-Device connectivity for unreachable geographies, end-to-end eSIM provisioning and visibility at scale, and SIM-based silent authentication replacing fraud-exposed SMS OTP. This press release features multimedia. View the full release here: https:...

05/26/2026 02:00
Toshiba Starts Shipping Engineering Samples of TXZ+™ Family Entry‑Class M4H Group, Standard Microcontrollers with Arm® Cortex®‑M4 Core for System Control Applications

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced TXZ+™ Family Entry‑Class M4H Group, standard microcontrollers[1] featuring an Arm® Cortex®‑M4 core with a floating-point unit (FPU). The new microcontrollers are designed for application in small‑scale system control of consumer products, such as air conditioners and washing machines, and in industrial equipment, including multifunction printers and factory automation systems. Toshiba is now providing engineering sam...

06/01/2026 22:35
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days

Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram exe...

06/02/2026 04:00
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications

Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-A...