09/24/2026 00:00
Asia Pacific Firms Focus on AI for Application Modernization

Organizations in Asia Pacific are reshaping application development and maintenance (ADM) with AI, accelerating change while retaining the control necessary for business continuity, according to a new research report published today by Information Services Group (ISG) (Nasdaq: III), a global AI-centered technology research and advisory firm. The 2026 ISG Provider Lens® AI-Driven ADM Services report for Asia Pacific finds that enterprises are modernizing complex IT environments that include le...

Future Health - A Global Initiative by Abu Dhabi: New Analysis Estimates Modifiable Health Risks Represent $16.4 Trillion Annual Global GDP Opportunity in 2050

Addressingbehavioural, metabolic and environmental health risks could generate an estimated $16.4 trillion in annual global GDP uplift in 2050. These findings are presented inThe Future of Healthy Living: A $16.4 Trillion Opportunity,a new whitepaper co-authored by Future Health – A Global Initiative by Abu Dhabi, the McKinsey Health Institute (MHI) and Healthy Living at the Department of Health – Abu Dhabi, and released on the sidelines of...
Anglais

SES Confirms Interim Dividend of EUR 0.25

The SES Board of Directors has approved the payment of an interim dividend of EUR 0.25 per A-share (EUR 0.10 per B-share) to be paid to shareholders on October 15, 2026, in...
Anglais
09/24/2026 02:00
NTT DOCOMO BUSINESS Launches “Pro”, a New docomo business SIGN® Offering for Large-Scale Global Connected Products

NTT DOCOMO BUSINESS, Inc. (formerly NTT Communications Corporation) announced today the launch of "Pro," a new offering in the docomo business SIGN®1 lineup, an IoT-focused Network as a Service (NaaS) with built-in security features. Designed to support the large-scale and global deployment of connected products, “Pro” helps customers manage and operate tens of thousands of IoT connections. The service will be available from March 2027. This new offering addresses the challenges of achieving ...

09/24/2026 02:00
Toshiba Launches 3300V SiC MOSFET Module with High Surge Current Capability that Helps Improve Reliability of Industrial Equipment

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I2t limit value in the diode...