Expo 2030 Riyadh and Mohammed Al Habib Real Estate Company (MAHR) have signed a 3.2 billion SAR joint venture agreement for the development and delivery of the Expo Village, the residential community for Expo 2030 Riyadh. The agreement represents the first joint venture milestone for Expo 2030 Riyadh and reinforces its commitment to partnering with the private sector to unlock economic opportunities and create lasting value, both in the lead-up to the Expo and well beyond the event itself. Thi...

Lenovo today announced Call Eva, a new initiative from Lenovo’s global Backing Every Business program that gives entrepreneurs a direct line to call Eva Longoria, Lenovo’s global ambassador, for insights on business growth, leadership and entrepreneurship. Entrepreneurs can now call and leave a voice note with their biggest business questions. Select callers may then be contacted and offered the opportunity to speak with Eva, live on September 16. This press release features multimedia. View t...

Circle Internet Group, Inc. (NYSE: CRCL), the global financial technology firm and issuer of USDC today announced it has signed a definitive agreement to acquire Tazapay, a Singapore-headquartered B2B cross-border payments infrastructure company focused on serving payment service providers and financial institutions. The deal is expected to close in 2027, subject to customary closing conditions and receipt of regulatory approvals, including approval from the Monetary Authority of Singapore. Th...

ProAmpac, a global leader in flexible packaging and material science, is proud to announce its role in supporting Circle K's launch of Flamin' Hot® Boneless Chicken Wings, created in partnership with PepsiCo/Frito-Lay. Designed to address key challenges in hot food packaging, ProAmpac's custom fiber-based tray helps maintain food quality, improve shelf appeal, and enhance the consumer experience. This press release features multimedia. View the full release here: https://www.businesswire.com/n...

HTEC, a global AI-first engineering and technology services company, and Modular have demonstrated Modular's AI software stack running on Google's TPU architecture. Presented at ModCon 2026, the work shows that support for a new silicon target can be delivered by extending an existing software foundation rather than rebuilding it for each accelerator. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260908670401/en/HTEC, a global AI-f...